Arden Hills, MN (PressExposure) May 29, 2014 -- Syagrus Systems' recent addition of two new pieces of key processing equipment, a Strasbaugh wafer grinder and an MTI metrology system, give the silicon wafer processing company increased backgrinding capacity and even more accurate measurement capabilities.
Syagrus Systems is a leader in post-fabrication, "back end" processing for silicon wafers. The company provides wafer backgrinding, wafer dicing and inspection, and other services for the semiconductor and electronics components manufacturing industries. Based in Arden Hills, Minnesota, in the Twin Cities (Minneapolis-St. Paul) metro area, Syagrus serves some of the biggest semiconductor manufacturers in the world and has long been at the forefront of wafer processing solutions.
The company's new Strasbaugh Model 7AF 200 mm wafer grinder gives them additional capacity for their wafer backgrinding and state of the art temporary wafer bonding and thinning processes. The Model 7AF uses ultra fine finishing wheels to create superior finishes, which in turn provide increased strength for ultra thin wafers. The company is currently grinding silicon wafers to target thicknesses less than 50 microns. By adding another fully automatic wafer grinding machine to their facility, Syagrus Systems offers even greater throughput for their constantly growing business, enabling them to better meet the high quantity demands of the semiconductor industry.
Syagrus' new MTI Proforma 200SA semi-automated silicon wafer measurement system provides highly accurate measurements of the TTV, or total thickness variance--the difference between the maximum and minimum values of thickness--of their clients' wafers following the grinding process. The Proforma 200SA can perform full wafer scans or use a fixed, user defined point scan pattern option for thickness measurements at the sub-micron level. This helps Syagrus Systems ensure the quality, consistency, and precision of their processes, and allows them to provide all their customers with complete measurement data sheets as certificates of compliance for their wafer backgrinding.